McDermid "HiTech Resin Products" corner bond, etc.
McDermid Performance Solutions Japan
Introducing products such as one-component thermosetting resins, one-component types, medium temperature range, and fast thermosetting!
Seiwa Co., Ltd. handles "HiTech resin products" manufactured by MacDermid. Founded in 1872, this American manufacturer has a global network and a wide range of adoption records under a unified world quality standard. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition development to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. Our lineup includes epoxy materials for dispensing at BGA edges and corners called "Corner Bond," as well as one-component types, medium-temperature, and fast-curing "Potting Compounds." "Underfill" is suitable for protecting solder joints of BGA, CSP, and flip chip components. For more details, please refer to the related catalog. 【Product Types (Partial)】 ■ Underfill: High-speed penetration, thermal cycling resistance, etc. ■ Corner Bond: Adhesion at edges and corners ■ Potting Compounds: Prevention of cracks in small components *For more information, please refer to the PDF materials or feel free to contact us.
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【Product Lineup】 <Underfill> ■ALPHA HiTech CU31-2030 ■ALPHA HiTech CU21-3240 ■ALPHA HiTech CU13-3150 <Corner Bond> ■ALPHA HiTech CF31-4010 ■ALPHA HiTech CF12-4485B <Potting Compounds> ■ALPHA HiTech 4210 Series *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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