Laser micro-hole processing
【Features】This product utilizes ultra-short pulse lasers on SUS material pipes to create fine hole processing. It is capable of processing not only flat plates but also cylindrical shapes like pipes. If you have any questions about the processing, please feel free to contact us. 【Material】SUS304 pipe, outer diameter φ1.5mm 【Processing range】Single-wall through hole diameter φ0.5mm
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basic information
◆Precision machining of difficult-to-cut materials and shapes ◆Automotive parts, medical device parts, electronic components, semiconductor components ◆Prototype and development projects Please leave it to us. We handle everything from processing to equipment setup. We have launched our satellite site "Ultra Short Pulse Laser.com." It is compatible with smartphone layouts, aiming to create a more user-friendly site. We appreciate your continued support. Satellite site: https://tyotannpulselaser.com/ ■ Hikari Machinery Manufacturing Co., Ltd. Address: 8-1 Ichinokata Nakano, Tsu City, Mie Prefecture 514-0112 Tel: 059-227-5511 Fax: 059-227-5514 E-mail: info@hikarikikai.co.jp Website: https://www.hikarikikai.co.jp/ Satellite site: https://tyotannpulselaser.com/ ■ HIKARI LASER LAB. Address: Room 511, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwa-no-ha, Kashiwa City, Chiba Prefecture 277-0882 Tel: 04-7170-4866 Fax: 04-7170-4866
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Applications/Examples of results
◆Microprocessing of difficult-to-cut materials and difficult-to-machine shapes ◆Automotive parts, medical device parts, electronic components, semiconductor parts ◆Prototyping and development projects
Company information
At "HIKARI LASER LAB.", we offer services for precision processing using ultrashort pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, surface modification has been required not only for shape processing like micro-hole drilling, cutting, trimming, and groove processing but also for functional enhancements such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is demand for marking inside glass from the medical industry. Laser processing is possible on transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and various materials including resin, CFRP, ceramics, and polyimide. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultrashort pulse lasers to meet our customers' needs!
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