A mobile electrostatic carrier that can instantly bond and release any substrate without adhesive.
The product is an innovative mobile electrostatic carrier developed by Eshylon Scientific. By adhering and reinforcing a thin substrate to a dedicated carrier, it handles fragile substrates without damage. It is possible to perform conventional processes on warped ultra-thin wafers using existing lines. With exceptional yield and high processing capacity, it meets the needs for substrate thinning. 【Features】 ■ High throughput ■ Improved yield ■ Low cost ■ Wide range of applications ■ No adhesive used *For more details, please visit our website or refer to the PDF materials, and feel free to contact us.
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basic information
【Specifications】 ■Size: 100mm, 150mm, 200mm, 300mm ■Thickness: 300um to SEMI standards, customizable *For more details, please visit our website or refer to the PDF materials, and feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Handling of thin wafers ■ Wafer thinning ■ Reuse of existing equipment without fab modifications *For more details, please visit our website or refer to the PDF materials, and feel free to contact us.
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Company information
NAGASE Techno Engineering Co., Ltd. (abbreviated as NTE) was established in 1983 as a machinery service company of Nagase & Co., Ltd. and changed its name to the current one in 2009. It is the core company for equipment development and maintenance services within the Nagase Group and is expanding its business globally. Our company operates three main businesses: the sale and maintenance of low-temperature and vacuum-related equipment used in the semiconductor and medical fields, a Chemical Management System (CMS) for the recycling of chemicals used in the manufacturing of semiconductors and LCD panels, and a surface defect inspection device (SCANTEC) for inspecting optical and functional films and sheets. We aim to strengthen our global engineering services by leveraging the Nagase Group's network that spans overseas. Furthermore, as a new challenge, we will utilize our high engineering expertise in the agricultural sector to benefit customers outside of domestic manufacturing.
