Introduction of application examples for material testing of microelectronics components and parts.
As electronic devices become smaller, they are also becoming more complex, and manufacturers along with their supply chains are required to miniaturize intermediate components in conjunction with the use of high-density packaging. Instron, as a global leader in materials testing systems, provides a wide range of solutions that meet industry standards such as JEDEC, MIL, SEMI, as well as IPC TM-650, AEC-Q100, and AEC-Q200. These solutions cover a variety of tests, from micro-bending tests of electronic packages to shear tests of integrated circuits (ICs) and bending tests of printed circuit board (PCB) finished products. 【Common Applications】 ■ Compression testing of IC packages ■ Die shear testing of electronic packages ■ Peel testing of copper runners ■ Micro-bending tests of PCBs *For more details, please refer to the PDF materials or feel free to contact us.
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【Representative Systems】 ■ Single-column tabletop testing machine ■ XY stage ■ Shear testing jig ■ Torsion addition option *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Instron was founded in 1946 by Harold Hindman and George Bahl, who were conducting joint research at MIT (Massachusetts Institute of Technology) at the time. They developed the world's first electromechanical (screw-type) universal testing machine. The name "Instron" is derived from "instrument" and "electronics." Instron's product range offers diversity that can cater to almost all global markets and industries, and since its establishment, over 70 years of testing technology and manufacturing experience have been built, with more than 50,000 systems operating worldwide. In 1965, Instron Japan was established to support customers in Japan. Currently, it has major bases in the United States, Europe, and Asia, providing sales and services in 40 languages through agents in 160 countries around the world.