Realizing double-sided tape supply (transport) with a robot [PICK FEEDER]
MKK-FSK-0220
With the combination of robots, we can now handle the automatic application and supply (transport) of double-sided tape, which has been difficult until now, at low cost for a variety of prototype work!
The MKK-FSK-0220 is a scalar robot (pick-and-place) device designed for fine work transfer and bonding, suitable for prototyping, small batch production, and cell production. This device is compact, allowing for easy integration and customization within production lines! (It can also be considered for use between semiconductor lines!) The typical method for bonding involves manual application using jigs, where each piece is applied one by one. However, by using a scalar robot (single-axis robot), suction, release, and application can be performed at a pleasant speed, enabling high-speed and high-precision bonding. 【Features】 ■ Ideal for prototyping, small batch production, and cell production ■ High-precision bonding at a pleasant speed ■ Compact design allows for integration within production lines ■ Can accommodate automatic discharge using conveyors or similar methods (consultation required) 【Compatible Tapes】 ■ Irregular tapes ■ Extremely thin tapes ■ Non-rigid tapes ■ Sponge/porous materials ■ Metal parts ■ Non-adhesive tapes ■ PI (polyimide tape) ■ Fine tapes ■ Ultra-small tapes *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Peeling work size: Work transfer and bonding at any position 1×1mm to 25×30mm ■Device configuration: Film feeder, SCARA robot, suction nozzle, image recognition camera ■Mounting destination: Customizable (consultation required) ■Mounting accuracy and speed: ±50μm, 2,000 CPH (tact priority, no alignment correction) ■Dimensions and weight: W850×D850×H1590mm, 150kg ■Power supply and operating air pressure: AC100V 500VA (MAX), 0.4Mpa or more 【Examples of Seal and Tape Usage】 ■Adhesion of reinforcement plates ■Adhesion of PI (polyimide) ■Bonding processing (lamination) ■Noise countermeasures / adhesion of shielding materials ■Adhesion of cover layers ■Assembly of flexible antenna reflective materials ■FPC multilayer assembly ■Adhesion of waterproof vent films to MEMS microphones and sensors ■Adhesion of cushioning materials to housings and contact parts ■Adhesion of mechanical parts / waterproof seals ■Assembly of optical units (light guides, diffusion films, etc.) ■Adhesion of polyimide and others to mounted circuit boards *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Peeling of fine work mounted on PET film *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company leverages two strengths: "measurement and control technology" and "design and assembly technology for precision components," focusing on creating new value in manufacturing. As a pioneering company, we have long accumulated technology in the field of non-destructive inspection equipment for fruits and vegetables. We have expanded our focus from traditional measurements centered on the sugar content of fruits to inspecting for rot, cavities, and browning inside vegetables. By developing machines that can accurately inspect produce with variations in shape and quality even under harsh operating conditions, we significantly contribute to quality assurance of the internal quality of fruits and vegetables in Japanese agriculture. In the field of electronic component mounting, we have been engaged in OEM and ODM production of tape feeders and surface mount technology for over 30 years, featuring production facilities that can flexibly accommodate everything from small quantities of diverse products to mass production. Recently, leveraging our years of technology and experience, we developed an original splicing jig that realizes labor-saving in board mounting. This has already attracted inquiries from many companies and received high praise from the market.