This conveyor, which uses a mounting machine (mounter) used in semiconductor devices, contributes to automation by achieving high-speed and high-precision supply of tape and seals!
With the combination of the FILM FEEDER and the mounting machine (mounter), it has become possible to transport tapes and seals that were previously done manually (adhesion)! The mounting machine (mounter) can not only perform electronic component mounting but also pick and place works such as seals and tapes. The FILM FEEDER connects to Yamaha Motor's mounter and is a device that can quickly and stably transport and peel off adhesive works or non-adhesive works mounted on PET film individually. We have compiled the available works for easy reference, so please take a look. 【Features】 ■ Adsorbs while peeling off the work (adsorption on the backing paper) ■ Simultaneous adsorption method ■ Peeling and adsorption on the base film ■ Attaches without damaging the adhesive surface ■ Peeling and adsorption of fine, extremely small, and non-rigid works 【Compatible Tapes】 ■ Irregular tapes ■ Extremely thin tapes ■ Non-rigid tapes ■ Sponge/porous materials ■ Metal parts ■ Non-adhesive tapes ■ Polyimide tapes ■ Fine tapes ■ Extremely small tapes ■ Double-sided tapes *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - Collaboration with seal processing manufacturers allows for proposals from material processing. - Possession of Yamaha Motor Co., Ltd. mount YS12P for verification with film feeders of 32mm and 104mm widths. - A system has been established to conduct test work production and attachment experiment verification. 【Equipment Specification Examples】 - Automation of the current lamination processes, such as the mounting of polyimide and double-sided tape on standard circuit boards and flexible substrates. 【Work Usage Examples】 - Attachment of reinforcement plates. - Attachment of PI (polyimide). - Lamination processing. - Noise countermeasures / attachment of shielding materials. - Attachment of cover layers. - Assembly of flexible antenna reflective materials. - Multi-layer assembly of FPC. - Attachment of waterproof vent films to MEMS microphones and sensors. - Attachment of cushioning materials to housings and contact parts. - Attachment of mechanical parts / waterproof seals. - Assembly of optical units (light guides, diffusion films, etc.). - Attachment of PI and other materials to mounted circuit boards. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company leverages two strengths: "measurement and control technology" and "design and assembly technology for precision components," focusing on creating new value in manufacturing. As a pioneering company, we have long accumulated technology in the field of non-destructive inspection equipment for fruits and vegetables. We have expanded our focus from traditional measurements centered on the sugar content of fruits to inspecting for rot, cavities, and browning inside vegetables. By developing machines that can accurately inspect produce with variations in shape and quality even under harsh operating conditions, we significantly contribute to quality assurance of the internal quality of fruits and vegetables in Japanese agriculture. In the field of electronic component mounting, we have been engaged in OEM and ODM production of tape feeders and surface mount technology for over 30 years, featuring production facilities that can flexibly accommodate everything from small quantities of diverse products to mass production. Recently, leveraging our years of technology and experience, we developed an original splicing jig that realizes labor-saving in board mounting. This has already attracted inquiries from many companies and received high praise from the market.