Regarding the curing temperature of epoxy resin during sample packaging.

Even with larger-sized circuit boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections, but since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener, but when embedding large samples such as printed circuit boards or touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we checked how much heat is actually generated during the curing process. For more details, please refer to the PDF download below. [Overview] ■ Temperature profile acquisition - Without heat generation prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat generation prevention treatment for a large amount of resin (large container) ■ Even with larger printed circuit boards, resin embedding is possible without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

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