【TAIYO】FPC Manufacturing Technology: "Notice Regarding the Development of All-Polyimide Build-Up Substrates"
太洋テクノレックス 本社 和歌山
We are pleased to announce that we have established core filled via technology for the development of build-up substrates using polyimide as the insulating layer, aimed at miniaturization, thinning, and lightweighting of multilayer substrates in our main business, the electronic substrate business.
In electronic devices, which are becoming lighter, more compact, and more functional, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, rigid boards are used for the core layer of build-up substrates, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices.
The filled via technology we have established involves filling holes (vias) opened with a laser in flexible printed circuit boards (FPC) with polyimide as the insulating layer with copper, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting while maintaining thinness.
We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.
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