[Case Study] Coating Suitable for Copper Materials with High Thermal Conductivity

Solving problems related to copper oxide coatings! Introducing examples of improvements!

We would like to introduce a case study that solved the problems faced by device manufacturers and parts manufacturers. 【Problems】 Copper materials, which have high thermal conductivity, are often used in heat sources and similar applications. At the typical processing temperature of fluoropolymer coatings (380°C), an oxide film forms on copper, leading to delamination between the oxide film and the copper itself. As a result, coating materials that require high processing temperatures cannot be used. This presents several issues, including many differences from standard surface treatments and lower durability. 【Improvements】 By using a coating material that has a low processing temperature, suppresses the formation of the copper oxide film, and has heat resistance comparable to fluoropolymer resins, we have achieved improvements. The non-stick performance and durability are also significantly enhanced. (Product model number KP-491-1) *For more details, please refer to the PDF document or feel free to contact us.

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