Excellent low dielectric properties and adhesion. For bonding high-speed transmission substrate materials such as mobile FPCs, including smartphones.
The "Alonmaitei AF-700 Series" is a thermosetting bonding film that boasts industry-leading low dielectric constant and low dielectric loss tangent. It can suppress transmission loss in the high-frequency range, making it suitable for electronic material applications. It is used in high-speed transmission substrate materials, such as flexible printed circuit boards (FPC) for mobile devices, including smartphones. It demonstrates excellent adhesion to difficult-to-bond substrates like polyimide and LCP, and offers good processability in FPC manufacturing. Customization is available upon request. 【Features】 ■ Low water absorption rate, maintaining high adhesion strength even in humid heat environments ■ Suitable as a bonding film for multilayer FPCs and adhesive layers for FCCL and coverlays ■ Also adopted for automotive millimeter-wave radar and antenna materials for base stations *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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【Other Features】 ■ Maintains low dielectric properties even after moisture heat treatment (85°C / 85% RH) ■ Exhibits excellent heat resistance during solder reflow ■ Proven track record with domestic and international circuit board material manufacturers and film manufacturers *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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Toho Chemical Industry offers a range of distinctive adhesives developed through Aronalfa and proprietary technologies. To meet diverse needs, from household use to industrial applications such as electronic materials, automobiles, and precision equipment, we have enhanced our lineup of high-performance adhesives, contributing to faster manufacturing and repair processes as well as cost reduction through the bonding of various materials.
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