Package software compatible with 300mm communication standards for embedded devices.
The "ConX300" is an embedded package software designed to build a communication interface compliant with the GEM300 standard for equipment. By incorporating this product into 300mm wafer-compatible equipment, it is possible to construct an equipment interface compliant with industry standard specifications such as SECS, HSMS, GEM, and GEM300 without the need for additional hardware. Based on over 20 years of experience in the semiconductor industry, the technical support staff of Mizuho Information & Research Institute will assist in the implementation of the equipment interface through customer training and technical support. 【Features】 ■ Manufactured by PEER Group, Canada ■ Ready-to-use package software ■ No dedicated screen required due to text-based GEM300 configuration management ■ Implementation of state models, object management, and scenarios compliant with each standard by calling functions according to the behavior of the equipment *For more details, please refer to the PDF materials or feel free to contact us.
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【Implementation Effects】 ■ It has been adopted by worldwide equipment manufacturers, ensuring reliability, stability, and compatibility. ■ With the usage training and technical support services provided by our company, even customers unfamiliar with SEMI standards such as GEM, SECS, and GEM300 can implement the equipment interfaces required in 300mm factories. ■ Flexible response to special specifications of each IC manufacturer and special specifications of equipment. ■ Capable of implementing communication interface systems compliant with various SEMI standards without the need for additional hardware. *For more details, please refer to the PDF materials or feel free to contact us.
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【Usage】 ■ Equipment compatible with 300mm wafers *For more details, please refer to the PDF document or feel free to contact us.
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