Our water-soluble phenolic resin demonstrates high adhesion even to substrates without bonding agents, such as polyester and cellulose.
We would like to introduce "binder for cationic substances" as an example of the applications of water-soluble phenolic resin from Konishi Chemical Industry Co., Ltd. We have found that water-soluble phenolic resins exhibit high adhesion even to substrates without bonding groups, such as polyester and cellulose. In addition to the hydrogen bonding strength between the hydroxyl groups of DHDPS and the carbonyl or hydroxyl groups of the substrate, the crosslinking (thermosetting) utilizing the methylol groups at the ends of resol-type water-soluble phenolic resin demonstrates high robustness. 【Features】 - Optimization of the molar ratio and molecular weight of DHDPS and sulfonic compounds - High adhesion to substrates without bonding groups - High robustness *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
Water-soluble phenolic resin - Resole resin of dihydroxydiphenyl sulfone (DHDPS) and phenol sulfonic acid - Solid content concentration: 30% - pH: 9-10 *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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KONISHI Chemical Industry Co., Ltd. develops, manufactures, sells, and provides contract manufacturing of functional chemicals used in a wide range of applications, including information electronic materials, functional resins, specialty monomers, silicon-based organic/inorganic hybrid materials, and pharmaceutical intermediates. We strive to translate new technologies and customer needs into chemistry in our own way, challenging ourselves to design new functional materials.