Sales of solder paste printing machines compatible with narrow and fine pitch, with a printing accuracy of ±10μm, and contract services such as bumping!
The "Solder Paste Printer TD-4420" is a paste-insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide suitable printing conditions for a wide range of printing needs. The realization of "hybrid squeegeeing," which combines contact printing and off-contact printing, challenges the limits of screen printing. The metal mask cleaner features both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer 'TD-4420' - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measuring Device - X-ray Observation Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also available. Please feel free to contact us.
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basic information
(Squeegee Unit Features) ■ The configuration stores paste in a cartridge shielded from outside air, preventing deterioration such as oxidation. ■ The rotation pressure of the roller shaft inside the cartridge ensures reliable filling of the paste into the mask opening. ■ The automatic replenishment and stirring functions maintain a constant amount of paste and paste viscosity within the cartridge. ■ The printing method does not leave paste on the mask after squeegeeing, reducing paste loss. (Metal Mask Cleaner Features) ■ Both dry and wet cleaners utilize a sandwich structure that contacts both sides of the metal mask, achieving stable cleaning effects. ■ The wet cleaner employs a complete washing method that thoroughly removes paste particles and flux residues from within the mask openings. (Examples of 'TD-4420' Adoption) ■ Formation of solder bumps on flip chip interposers (bump pitch 150–200μm). ■ Formation of solder bumps on wafers for printed devices (bump pitch 120–150μm). ■ Formation of solder bumps on wafers for communication devices (bump pitch 150–170μm). ■ Filling of conductive paste into via holes of substrates for optical devices (via diameter 250–300μm).
Price range
P7
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing a one-stop service from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products that meet ISO 9001, ISO 14001, as well as ISO 13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.
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