High precision design with a printing accuracy of ±10μm enables narrow and narrow-pitch printing! By realizing 'hybrid squeegeeing,' we challenge the limits of screen printing.
The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste press-in method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8-inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4-inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from the outside air, which helps prevent degradation such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a consistent amount and viscosity of the paste within the cartridge. - This printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demos in a clean room (Class 10,000) are also possible. Please feel free to contact us.
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(Features of Metal Mask Cleaner) - Both dry and wet cleaners achieve stable cleaning effects with a sandwich structure that contacts both sides of the metal mask. - The wet cleaner adopts a full washing method that completely removes paste particles and flux residues inside the mask openings. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing a one-stop service from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products that meet ISO 9001, ISO 14001, as well as ISO 13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.
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