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  6. [Data] Whisker Analysis by EBSD

[Data] Whisker Analysis by EBSD

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last updated:Nov 06, 2020

アイテス
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Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!

This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We invite you to read it. 【Published Case Studies】 ■Observation/Cross-section preparation ■Analysis using EBSD *For more details, please refer to the PDF document or feel free to contact us.

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[Data] Whisker Analysis by EBSD

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Whisker evaluation

Whisker evaluation

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Cross-section polishing service for implementation parts and electronic components.

Cross-section polishing service for implementation parts and electronic components.

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] High melting point solder

[Example of analysis using EBSD] High melting point solder

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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Crystal analysis by EBSD: Intermetallic compounds in solder joints.

Crystal analysis by EBSD: Intermetallic compounds in solder joints.

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EBSD analysis

EBSD analysis

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[Analysis Example Using EBSD] Steel Plate

[Analysis Example Using EBSD] Steel Plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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[Example of Analysis by EBSD] Screw

[Example of Analysis by EBSD] Screw

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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[Data] Whisker Analysis using EBSD

[Data] Whisker Analysis using EBSD

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Information] Whisker Observation - Tips for Observing Flat Whiskers

[Information] Whisker Observation - Tips for Observing Flat Whiskers

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Example of analysis of compounds at the SAC solder and Ni pad interface.

Example of analysis of compounds at the SAC solder and Ni pad interface.

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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