It can be understood that the thermal conductivity is lower than that of calcium silicate boards, indicating high insulation performance!
This document is a technical data sheet introducing the thermal insulation performance of honpanels. The explanation of terms provides a clear overview of thermal conductivity (λ value) and thermal transmittance (U value). Additionally, the thermal insulation performance of various backing materials is illustrated with examples of thermal conductivity for different materials and their thermal transmittance for various thicknesses. [Contents] ■ Explanation of terms ■ Thermal insulation performance of various backing materials *For more details, please refer to the PDF document or feel free to contact us.
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March 1958: Established Honshu Packaging Materials Industry Office March 1963: Established Honshu Packaging Industry Co., Ltd. July 1967: Relocated headquarters to the current location January 1987: Completed new company building June 1992: Changed company name to Good Light Honshu Co., Ltd.