Back surface polishing of semiconductors for luminescence analysis.

Back grinding is possible with various types of semiconductors! You can observe the elements and the condition of defects.

Back Surface OBIRCH / As a preprocessing step for luminescence analysis or back surface luminescence analysis, we perform back surface polishing of samples with various shapes. This is an essential preprocessing step for conducting analysis from the back surface. By analyzing from the back surface, it is possible not only to detect luminescence while retaining defects but also to observe the presence or absence of shape abnormalities. Additionally, back surface polishing can be performed on various forms of semiconductors, such as packages, opened chips, and wafers, and it is also possible to perform back surface polishing while preserving the lead terminals. 【Features】 ■ Back surface analysis requires polishing because it does not transmit light due to shading by electrodes or light attenuation from high-density substrates. ■ Luminescence can be detected while retaining defects. ■ The presence or absence of shape abnormalities can also be observed. ■ Back surface polishing can be performed while preserving the lead terminals. *For more details, please refer to the PDF document or feel free to contact us.

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