Introduction to Particle-PLUS Analysis Case Studies: "Three-Dimensional Analysis of Capacitively Coupled Plasma (CCP)" Simulation Case Study
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.
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basic information
**Features** - The time scheme uses an implicit method, allowing for stable time evolution to be calculated over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the plasma module above, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in plasma and neutral gas environments in magnetron sputtering devices, enabling rapid assessment of flux distribution on opposing substrates. *For other functions and details, please feel free to contact us.*
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P4
Applications/Examples of results
【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to achieve high-density plasma - Damage to the chamber walls - Optimization of power using an external circuit model - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and realistically - Calculations are relatively stable to avoid applying excessive voltage 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Time Evolution of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - Changing calculation conditions allows for the optimization of high-density plasma generation at low power
Detailed information
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Three-dimensional analysis model of capacitively coupled plasma (CCP)
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Electric potential
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Particle number density
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Energy distribution
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Particle flux on the electrode
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![[Case Study] CCP Plasma Simulation Using the Particle-PLUS External Circuit Model](https://image.www.ipros.com/public/catalog/image/01/d15/513467/IPROS49127693160706889091.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS Cylindrical Magnetron Device Plasma Sputtering Simulation](https://image.www.ipros.com/public/catalog/image/01/28d/513469/IPROS57753432477912697050.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS DC Magnetron Sputtering Simulation](https://image.www.ipros.com/public/catalog/image/01/426/513472/IPROS31362668036278405479.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS DC Magnetron Sputtering (3D Calculation) Simulation](https://image.www.ipros.com/public/catalog/image/01/600/513473/IPROS14341653820382667928.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS Counter-Target Sputtering Simulation](https://image.www.ipros.com/public/catalog/image/01/33c/513474/IPROS71008523339880745470.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS Opposing Target Sputtering Simulation](https://image.www.ipros.com/public/catalog/image/01/86c/513475/IPROS47056299894055276861.jpeg?w=120&h=170)
![[Case Study] Particle-PLUS RF Magnetron Sputtering Simulation](https://image.www.ipros.com/public/catalog/image/01/bb3/513673/IPROS35622406148691072631.jpeg?w=120&h=170)
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Our company develops and sells a "Maintenance Management System" for managing and operating various plants, factories, and other facilities and assets. Currently, this system is undergoing significant evolution into a system that incorporates IoT technologies, such as sensor information and input from tablet devices, as well as AI technologies like machine learning, featuring functions for failure prediction and automatic scheduling. Additionally, as part of the recent trend of digital transformation (DX), there is a growing movement to digitize and automate manufacturing processes and research and development sites in factories to improve operational efficiency. In line with this trend, our company provides a solution aimed at enhancing efficiency in research and development environments, which is the Laboratory Information Management System (LIMS). This software includes features such as workflow management, data tracking, data management, data analysis, and integration of electronic lab notebooks.