Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)
2054 Printed Circuit Board BOD
Technical Specialized Books - Focusing on Automobiles and 5G Applications
Unraveling substrate, wiring, and mounting materials and technologies aimed at 'miniaturization and high density,' 'high speed and high frequency,' and 'flexibility' ---------------------------- ■ Key Points of This Book ◎ Response to automotive and miniaturization for high density ◎ Response to 5G and high-speed communication ◎ Advancement of mounting and design technologies
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■Table of Contents (Excerpt) Chapter 1: Future Trends of Implementation Components Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Device Boards Chapter 3: Car Electronics and In-Vehicle Boards Chapter 4: Development of Board Materials for Power Electronics Devices Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications Chapter 6: Development of High-Frequency Board Materials Chapter 7: Design of High-Frequency Boards Chapter 8: Development of Flexible Printed Wiring Boards Chapter 9: Development of Embedded Component Board Technology Chapter 10: Printed Circuit Boards for Miniaturization and Thin Layering Chapter 11: Improvement of Connection Reliability Chapter 12: Fine Wiring Formation Technology Chapter 13: Via Formation for Board Stacking Chapter 14: Noise Countermeasure Technology －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Published: May 29, 2020 ●Authors: 65 people ●Format: A4 size, 713 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5 After receiving your order, we will perform simple printing and binding －－－－－－－－－－－－－－－－－－－－－－－－－－
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40,000 yen (excluding tax) [including shipping]
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