Silver powder that achieves world-class conductivity and low-temperature sintering characteristics.
Attention semiconductor and circuit board designers! Are you looking to increase the conductivity of your products and reduce sintering temperatures? There are silver nanoparticles that exhibit remarkable performance in semiconductors and circuit boards, which are increasingly demanding higher performance. Introducing "TOSFINE" from Toxen Industries. "TOSFINE" is produced using our unique particle manufacturing technology, which processes each particle into a flake shape, resulting in silver powder that combines the handling characteristics of flakes with the properties of nanoparticles. "TOSFINE" offers high conductivity and high mirror-like finish under dry conditions due to its highly smooth surface. 【Features】 - Achieves high conductivity and heat dissipation through single crystal flakes. - Exhibits sintering characteristics at low temperatures (120-200°C). - Realizes high conductivity even under dry conditions due to its high surface smoothness. - Has a uniform particle size distribution due to our unique manufacturing method. - We can propose particle sizes and surface treatments tailored to your applications.
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basic information
【Products Handled】 Silver nanoparticles / Silver powder / Silver flakes / Single crystal silver flakes
Price information
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Delivery Time
※Usually 1 month
Applications/Examples of results
- Electrode paste and ink for solar cells - Electrode paste for displays - Touch panels, plasma displays - Adhesives for bonding electronic and electrical components - Conductive paste for circuit boards - Fillers for metallic ink
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Company information
Since our establishment in 1934, we have leveraged the technical expertise we have cultivated and the infinite potential unique to material manufacturers. We have received high praise from our customers across a wide range of fields, including tires, engine parts, medical applications, semiconductors, home appliances, and solar power generation, starting with wires used in these areas. Moving forward, we will continue to expand our broad innovations, diversity, and globalization, creating new trust, safety, and innovation through our core technologies.