The PbS chip utilizing trinamiX's thin-film sealing technology can achieve double sealing through the TO package.
The dual sealing technology using thin films and TO packages achieves long lifespan and optimal detectability at room temperature. It is a TO package type that enhances safety, robustness, and compatibility with existing products.
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basic information
Features • Double encapsulation (thin-film and TO package) • High durability for rugged operation • Very high sensitivity • Room temperature operation • Sapphire window
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Applications/Examples of results
Applications • Flame monitoring • Flame and spark detection • Gas detection and analysis • Spectroscopy • Temperature measurement • Moisture measurement
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If you have any inquiries regarding infrared technology, please feel free to consult with us. We will introduce you to the world's cutting-edge technologies. We handle a wide range of infrared equipment, including blackbody furnaces, spectrometers, infrared cameras, CO2 monitors, and wafer temperature monitors, as well as infrared components such as sensors, windows, and lenses. We also offer measurement services and equipment rentals. If you are unsure about selecting optical components such as infrared sensors, filters, or window materials, please do not hesitate to contact us.
![[Solution Example] Spoon and Fork Packaging](https://image.www.ipros.com/public/product/image/bd9/2000736420/IPROS90370814906700534129.png?w=280&h=280)
