Cost reduction case studies in transportation, packaging, and logistics: Conductive partition plates for automotive parts.
Many achievements in the Tohoku region! The strict dimensions at both ends are designed in a U-shape integrated with the bottom board! We will introduce examples of cost reduction in transportation, packaging, and logistics.
We would like to introduce a case study of a conductive partition board for automotive parts. The packaging material is intended for transporting industrial products, and when we received a request from the customer, there were specifications for a designated box and a desired quantity (30 pieces). In our proposal, we made it possible to package the desired quantity in a single layer (3×10), and the strict dimensions at both ends were designed as a U-shape integrated with the bottom plate. Additionally, since the products have protrusions such as claws, there was initially a discussion about whether to orient those parts upwards. However, due to the difficulty of packaging in the designated box concerning dimensions when aiming for the desired quantity, we evaluated the desired specifications against the actual packaging results and confirmed that vertical placement posed no issues, allowing us to meet the customer's expectations. *For more details, please refer to the PDF document or feel free to contact us.*
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【Case Overview】 ■ By Application: Transport Boxes / Carts and Others ■ By Industry: Electronics / Precision Equipment / Semiconductors ■ By Material Function: Logistics Efficiency / Conductive / Static Prevention ■ Classification List by Packaging Item Name: Automotive Parts ■ By Packaging Material: Plastic Cardboard Types ■ By Purpose: To transport products "efficiently" *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects related to static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far, along with various new materials developed in recent years to address environmental issues, to offer the best combination. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop test machine from Ransomont, analyze the shock waveforms with test partners, and propose the optimal cushioning packaging design.