This is an introduction to KGK Joint Research Chemical Co., Ltd.'s products for semiconductors.
We would like to introduce products that can be applied to the following semiconductor processes. 【Manufacturing Processes】 - Semiconductor dicing process - Semiconductor backgrinding process - Semiconductor lithography process - Semiconductor lead frame mount, wire bonding, and package molding process - Lightweight, thin, small component fixing process
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basic information
【KGK Semiconductor Products】 - UV-curable → Dicing and back grinding tape - Antistatic → Antistatic film - Rework → Make ring gel - Solvent-resistant (etching solution) → Protective film for photomasks - Heat-resistant → Polyimide tape and heat-resistant molecular gradient film double-sided tape - Insulation → Single-sided and double-sided tape for insulation - Thin film strong adhesion → Molecular gradient film double-sided tape
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Applications/Examples of results
Materials for each semiconductor process
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials such as construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.