Technical Specialty Books: For Further Improvement of Thermal Conductivity
- Filler compounding, structural control, molecular design, thermal conductivity evaluation - ◎ Response to temperatures above 200°C ◎ Use of nitride fillers ◎ Achieving both "insulation" and "heat dissipation" ⇒ A comprehensive collection of the latest technologies for next-generation power devices, LEDs, and automotive electronics! --- ■ Structure of this document ◆ Handling of high thermal conductivity fillers and compounding technology with resins ◆ - Detailed explanation of the thermal conductivity and functional characteristics of various high thermal conductivity fillers - Dispersion control and stabilization techniques for high thermal conductivity fillers - Orientation control techniques for fillers and their effects - - - ◆ Development of high thermal conductivity resins for next-generation devices such as power semiconductors ◆ - Temperature characteristics when using power semiconductors and LEDs - What are the characteristics of nitride fillers, which are attracting attention as high thermal conductivity fillers? - - ◆ Methods and points for measuring thermal conductivity ◆ - How to use thermal conductivity measurement devices and key points - Measurement of thermal diffusion and thermal conductivity of thermal interface materials - Flash method, quasi-steady method, distance change method, frequency change method... - - -
Inquire About This Product
basic information
■Table of Contents Chapter 1 Mechanisms of Thermal Conductivity in Polymers Chapter 2 Properties of Thermally Conductive Fillers Chapter 3 Techniques for Compounding, Dispersion, and Orientation Control of Fillers Chapter 4 Electrochemical Measurement and Analysis of Solar Cells Chapter 5 Enhancing Thermal Conductivity of Resins through Structural Control and Molecular Design Chapter 6 Thermal Expansion Control Techniques for Resin Materials Chapter 7 Development of High Thermal Conductivity Elastomers and Carbon Materials Chapter 8 Development of High Thermal Conductivity Resin Materials Required for Power Semiconductors, Automotive Electronics, and LEDs Chapter 9 Design of Heat Dissipation Implementation and Structures for Power Semiconductors, Automotive Electronics, and LEDs Chapter 10 Evaluation and Analysis Techniques for the Thermal Conductivity Properties of Heat Dissipation Materials －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: July 31, 2019 ●Authors: 60 ●Format: A4, 524 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-754-1 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-006-4 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
Price information
44,000 yen (including tax) [shipping included]
Price range
P2
Delivery Time
P2
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs![[Book] Development of High Thermal Conductivity Materials (No. 2001BOD)](https://image.www.ipros.com/public/catalog/image/01/52f/475589/IPROS22317625441284569928.jpeg?w=120&h=170)
News about this product（1）
Company information
The Technical Information Association works to shape information for engineers and researchers. We research what kind of information engineers and researchers active in fields such as "research and development," "materials," "electronics," and "pharmaceuticals/medical devices" need, and create products such as seminars, books, and distance learning courses!