[Book] Development of High Thermal Conductivity Materials (No. 2001BOD)

■ Table of Contents
Chapter 1 Mechanisms of Thermal Conductivity in Polymers
Chapter 2 Properties of Thermally Conductive Fillers
Chapter 3 Techniques for Compounding, Dispersion, and Orientation Control of Fillers
Chapter 4 Electrochemical Measurement and Analysis of Solar Cells
Chapter 5 Enhancing Thermal Conductivity of Resins through Structural Control and Molecular Design
Chapter 6 Thermal Expansion Control Techniques for Resin Materials
Chapter 7 Development of High Thermal Conductivity Elastomers and Carbon Materials
Chapter 8 Development of High Thermal Conductivity Resin Materials Required for Power Semiconductors, Automotive Electronics, and LEDs
Chapter 9 Design of Heat Dissipation Implementation and Structures for Power Semiconductors, Automotive Electronics, and LEDs
Chapter 10 Evaluation and Analysis Techniques for Thermal Conductivity Properties of Heat Dissipation Materials
--------------------------
● Published: July 31, 2019 ● Authors: 60 individuals ● Format: A4 size, 524 pages
Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-754-1
↓↓ The hardcover edition is out of print ↓↓
On-Demand Edition Available
Price: 44,000 yen (tax included) ISBN: 978-4-86798-006-4
After receiving your order, we will perform simple printing and binding.
--------------------------


Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Technical Information Association site