Resins that can be used at temperatures from 120 to 250℃! Equipment design for small to large volume discharge is possible.
The "Hot Melt Molding Device" is a machine that sets the parts to be molded inside a mold and injects hot melt at low temperature and low pressure for molding. It is compatible with single-component resins such as polyamide-based, polyester-based, polyolefin-based, and moisture-curing polyurethane hot melts. It is suitable for electronic components and automotive parts. 【Features】 ■ Precise discharge using a gear pump ■ Discharge using a screw is also possible ■ Capable of discharging resins from low viscosity to high viscosity ■ Device design can accommodate both small and large discharges ■ Mold design ensures good workability *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Other Features】 ■ Injection pressure ranges from 0.7 to 10 MPa ■ Molding clamping pressure options from 500 kg to 5 tons ■ Resins that can be used range from 120 to 250°C ■ Excellent maintainability with simple cleaning tasks ■ Focused on creating equipment tailored to resin properties and products *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Electronic components / Automotive parts / Harness components ■ Various sensors / Switches ■ Flexible substrates ■ Coil products *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Ebino Kousan Co., Ltd. is a company engaged in the manufacturing and sales of adhesive equipment, sales of adhesives, and general cargo transportation services. With a focus on the adhesive business, transportation business, and warehousing business, we have established bases primarily in the Kansai region (Osaka) and also in the Kanto region (Chiba and Saitama), utilizing a nationwide network to support our customers' comprehensive logistics. Please feel free to contact us.
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