Achieves stable low particle characteristics, eliminating the need for cleaning processes! Adheres closely to the uneven surfaces of the wafer circuit!
"Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■BGE-122S ■BGE-122V ■BGE-124S ■BGE-1250A3 ■P-Series *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Protection of the circuit surface during wafer backside grinding, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Denka is a chemical company that develops a wide range of businesses, from inorganic and organic industrial materials to civil engineering and construction materials, electronic materials, food packaging materials, and pharmaceuticals. Founded on the production of chemicals using electric furnaces, the company has advanced high-temperature and firing control technologies and nitriding technologies, applying them to organic synthesis and polymer processing to diversify its business. At the same time, to secure the energy that supports these efforts, we have focused on constructing hydroelectric power plants and energy conservation. We are committed to sincerely addressing societal challenges and market needs, striving to respond faithfully to your expectations, and aiming to be a trusted manufacturing company for years to come.