You can understand the basics of "heat transfer" necessary for thermal design, such as the mechanisms of heat conduction and simple calculation formulas! We are currently publishing the materials (digest version) distributed during the seminar.
Our company is engaged in the sale of thermal design support tools and solutions, and we also regularly hold a free seminar titled "Introduction to Thermal Design of Electronic Devices." For those who are unable to attend the seminar due to scheduling conflicts or those who would like to know the content in advance, we are currently providing a digest version of the seminar materials that will be used at the venue. We have summarized the fundamental aspects, so even those who do not regularly conduct thermal analysis can keep it on hand and refer to it occasionally for their use. We provide an easy-to-understand explanation of the basic knowledge related to "heat transfer," which is necessary for engaging in the design of electronic devices, including general guidelines for the thermal conductivity of commonly used electronics materials and the mechanisms of convection and radiation. [Contents (excerpt)] ■ Thermal issues have become increasingly serious ■ Heat and heat transfer viewed microscopically ■ Calculation of thermal conduction (one-dimensional steady-state thermal conduction) ■ Temperature of objects and thermal radiation * You can view the detailed content immediately by downloading the PDF. The complete version will be distributed to those who participate in the seminar. For more details, please feel free to contact us through the "Contact Us" section.
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**About the Introduction to Thermal Design of Electronic Devices Seminar** In this seminar, we will explain the fundamental knowledge of heat transfer that those involved in the design of electronic devices should know, incorporating practical exercises. Additionally, we will cover the heat dissipation mechanisms of electronic devices and thermal countermeasures, as well as the established practices for thermal design and countermeasures at various implementation levels, including enclosures, circuit boards, and devices. *For more details about the seminar, please feel free to contact us.*
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*For more details, please refer to the materials. Feel free to contact us as well.*
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.