Solve trade-off problems such as temperature, size, EMC, and noise with multi-objective optimization!
We will introduce examples of thermal design and thermal design consulting. In thermal design, there are many challenges such as cooling of heat-generating elements and cost reduction. However, trade-off issues related to temperature, size, EMC, and noise can be resolved through multi-objective optimization. Therefore, we propose the multi-objective robust design optimization support tool 'modeFRONTIER' and the thermal design support tool specifically for electronic devices 'FloTHERM'. By utilizing the "FloTHERM node" in modeFRONTIER, complex settings and operations are unnecessary, allowing for easy optimization. Furthermore, since simultaneous execution of multiple jobs is possible, the time required for calculations can be reduced. [Case Study] ■ Challenge: Trade-off issues related to temperature, size, EMC, and noise ■ Proposed Products: Multi-objective robust design optimization support tool "modeFRONTIER" Thermal design support tool specifically for electronic devices "FloTHERM" ■ Benefits: No complex settings or operations are required, making optimization easy *For more details, please refer to the PDF materials or feel free to contact us.
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"Resolved with 'FloTHERM Node'!" ■ Seems difficult to set up → Variable listing by parameter tuning ■ Can't afford to spend labor hours... → Automatic workflow construction feature ■ Isn't the operation cumbersome? → Automatic execution of analysis calculations *For more details, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.