Tape (UV-curable type) for protecting and securing wafers during the semiconductor dicing process.
1. Excellent scalability. 2. Low wafer contamination.
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basic information
【Product】 Tape for protecting and securing wafers during the semiconductor dicing tape process. 【Features】 1. Excellent extensibility. 2. Minimal wafer contamination. 【Applications】 For semiconductor dicing processes.
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For semiconductor dicing process
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials such as construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.