It is an acrylic-based thermally conductive adhesive gel sheet.
- Being non-silicone based, it does not contain volatile components of "siloxane," preventing contact interference in electronic components and contamination of glass. - It uses excellent fillers as a filler, resulting in superior thermal conductivity. - It has excellent reworkability. - Due to its soft material, it conforms well to areas with significant irregularities. - It has excellent adhesion, reducing contact thermal resistance. - It excels in stress relief, reducing pressure on electronic components after embedding. - It is highly durable, demonstrating stable electrical insulation and thermal conductivity even after prolonged use.
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basic information
**Composition** Type of polymer: Acrylic-based adhesive resin Type of filler: Thermally conductive inorganic filler Color: White Release liner: Silicon-treated PET **Features** - As it is non-silicone based, it contains no volatile components of "siloxane," preventing contact inhibition of electronic components and contamination of glass. - Uses excellent fillers for thermal conductivity. - Excellent reworkability. - Due to its soft material, it conforms well to large uneven surfaces. - Excellent adhesion reduces contact thermal resistance. - Excellent stress relief reduces pressure on electronic components after embedding. - Highly durable, demonstrating stable electrical insulation and thermal conductivity even after prolonged use. **Applications** Prevention of CPU thermal runaway Thermal management of IC chips Heat dissipation for LEDs Improvement of heat dissipation characteristics at various connection points Heat dissipation for heat-generating parts of electronic devices *Efficiently transmits heat generated in semiconductor products to heat dissipation components such as heat sinks and metal covers.*
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Applications/Examples of results
Prevention of CPU overheating Thermal measures for IC chips Heat dissipation of LEDs Improvement of heat dissipation characteristics of various connection parts Heat dissipation of heat-generating parts in electronic and electronic devices *Efficiently transferring heat generated in semiconductor products, etc., to heat dissipation components such as heat sinks and metal covers.
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials such as construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
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