From semiconductor packages to substrates and enclosures! A thermal fluid analysis tool applicable to various electronic devices.
"FloTHERM" is a thermal fluid analysis tool for electronic devices. It can be applied to various electronic devices, from entire systems to individual semiconductor packages. Additionally, we offer a range of tools centered around this product, such as "FloTHERM XT," which enables seamless integration with 3D CAD, and "FloTHERM PACK," which allows for the creation of detailed models of semiconductor packages even without knowledge of their internal structures, achieving accurate temperature predictions within components. 【Features】 ■FloTHERM - Use of shape templates - Importing 3D CAD data via FloMCAD Bridge - Object-oriented mesh ■FloTHERM XT - SOLIDWORKS-based thermal fluid analysis tool - Automatic mesh generation for curved and angled shapes *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Examples】 ■FloTHERM PACK - Even without understanding the internal structure, it enables the creation of detailed models of semiconductor packages and achieves accurate temperature predictions within components. ■FloTHERM PCB - Analysis is completed in three steps: model creation, environmental condition selection, and calculation execution, supporting circuit and board designers in component placement considerations. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.
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