Complete thermal analysis of a car using FloTHERM - A case study of thermal design for electronic devices in the automotive field.
We will introduce examples of thermal design for electronic devices in the automotive field using the thermal design support tool 'FloTHERM' specifically for electronic equipment. Automobiles are equipped with many electronic devices, such as power control units and LED backlights. It is possible to conduct thermal design and cooling method studies for IGBT structures, as well as thermal design for in-vehicle instrument panels and conceptual thermal design for ECU boards. 【Examples】 ■ Thermal design and cooling method studies for IGBT structures - Model the internal structure of IGBT modules, which are key components of hybrid and electric vehicles, and perform thermal design for the module alone. - Additionally, place the IGBT module on a cooling device to optimize the cooling structure of the device. ■ Thermal design for in-vehicle instrument panels - Model a 6-layer board, including wiring patterns, and verify the device and board surface temperatures when heat generation reaches a steady state. *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Examples】 ■ Thermal Design in the Concept Stage of ECU Circuit Boards - Exploring thermally advantageous wiring for key components on the circuit board while considering constraints such as EMC, using optimization tools. - This minimizes the number of actual measurements and reduces total costs. ■ Analysis of Engine Cooling Fan Control ECU - An electronic motor control device that regulates the speed of the engine cooling fan. - Established a method to accurately predict the internal temperature of the device in a short time by combining thermal analysis with infrared imaging equipment. ■ Analysis of High-Brightness LED Headlamps - Conducted thermal analysis on headlamps with three LEDs installed on five circuit boards, achieving suitable water cooling mechanism design. *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■ Thermal design of electronic devices in the automotive field *For more details, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.
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