[Case Studies of Thermal Design and Thermal Design Consulting] Detailed Thermal Design of Circuit Boards
Printed circuit boards are important heat dissipation pathways! Are you considering the impact of the wiring patterns?
We will introduce examples of thermal design and thermal design consulting. The printed circuit board is an important heat dissipation pathway. For small components, most of the heat escapes through the board, so it is essential to accurately model the density of the wiring patterns. Therefore, we propose the electronic equipment-specific thermal design support tool "FloTHERM." It allows for easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail. The wiring patterns of multilayer boards are pixel-split, and equivalent thermal conductivities are automatically calculated for each area. [Case Study] ■ Issue: Detailed thermal design of the board ■ Proposed Product: Electronic equipment-specific thermal design support tool "FloTHERM" ■ Benefits: Easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail *For more details, please refer to the PDF materials or feel free to contact us.
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**Overview** "FloTHERM" is a thermal fluid analysis tool that can be applied to a variety of electronic devices, from entire systems to individual semiconductor packages. To enable thermal designers to use it efficiently, various features have been incorporated, such as intuitive model creation capabilities, instant mesh generation, and result processing functions focused on thermal design. Tools such as "FloTHERM PACK," which supports the modeling of semiconductor package components, "FloEDA Bridge," which reads PCB CAD data to efficiently create analysis models, "FloMCAD Bridge," which supports the creation of enclosure models by reading 3D CAD data, "FloTHERM PCB," tailored for electrical and PCB designers, and "FloTHERM XT," which allows for accurate analysis of curved and angled shapes based on 3D CAD, effectively utilize the FloTHERM toolset to support collaborative electromechanical design between electrical and mechanical designers. *For more details, please refer to the PDF document or feel free to contact us.*
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【Purpose】 ■Detailed thermal design of the substrate *For more information, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.
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