Metal thin films are formed from roll to roll on various substrates.
At Kawamura Industries, we perform sputtering processing of copper, nichrome alloy, and chromium on various substrates. If greater adhesion is required, we can propose pre-treatment using our plasma treatment. **Features of Kawamura Industries' "Sputtering Processing"** - Roll to roll sputtering processing → Example of copper sputtering: thickness 0.1 to 0.2 μm - Capable of continuous film formation with different metal types → Multiple cathodes used - Supports sputtering of copper, nichrome alloy, and chromium *For target materials other than those mentioned above, please consult us. *For more details, please refer to the PDF document or feel free to contact us.
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【Base Material Dimensions】 ■Maximum Base Material Width: 1,100mm 【Effective Width】 ■Maximum Effective Width: 1,000mm *For other conditions, please refer to the PDF document or feel free to contact us.
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Our company specializes in insulation processing, electronic materials, and precision processing, achieving high quality, high performance, and timely production through high technology and refined skills.