High-performance insulating adhesive film for electronic components and modules

Thin films and high-insulation adhesive films that respond to the "thinning" and "miniaturization" of semiconductors and passive components!

The "High-Performance Insulating Adhesive Film for Electronic Components and Modules" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adofrema." It features a thin-layer insulation with low dielectric constant and low dielectric loss tangent, making it optimal for GHz band high-frequency characteristics. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it is a thermosetting resin film in an unreacted state that can achieve high adhesion, high heat resistance, and high reliability. It is applicable to electronic components for RF modules that require miniaturization and low profile. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ Thin-layer insulation: 5–30µm thickness ■ Excellent filling properties for uneven surfaces at low temperature and low pressure ■ Thermosetting resin film ■ Applicable to electronic components for RF modules *For more details, please request materials or view the PDF data available for download.

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