Introduction to Electrolytic Plating Processing Technology

Introduction of a plating system compatible with 6-inch wafers! Processing technology capable of forming films of a few micrometers.

"Electroplating" is a processing technology that involves immersing a substrate in an aqueous solution containing ionized metal and passing electricity through the solution to deposit metal onto the surface of the substrate. Film formation through vapor deposition is typically less than 1μm, while plating can form films of several micrometers. Additionally, there is a technology called "semi-additive method" that utilizes this technique to create fine plating patterns. [Features] ■ Deposits metal on the surface of the substrate by passing electricity through the solution ■ Can be used in precision machining fields to achieve desired metal film thickness ■ Capable of forming films of several micrometers ■ Applicable to create fine plating patterns using the "semi-additive method" ■ Introduced a plating system compatible with 6-inch wafers *For more details, please refer to the catalog or feel free to contact us.

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