Ultra-precision slitting processing performed in a cleanroom environment of class 10,000.
In the "slit processing," we perform film and slit processing for semiconductor, LCD, and medical-related applications in an environment with a cleanliness level of "10,000 or below" and specialized equipment to prevent foreign matter contamination. We have established a high precision cutting accuracy of 0.05mm and a burr precision of less than 10μ, receiving high praise for our technology. Additionally, we have equipped devices to prevent yield loss due to potential thickness deviations in the film, contributing to longer roll lengths and improved yield rates. 【Features】 ■ Work environment with cleanliness level of class 10,000 ■ Constant indoor temperature of 20°C and humidity of 50% ■ Precision capable of burr heights below 10μ ■ Complete cleanroom attire (clothing, hats, gloves, shoes) ■ Prohibition of bringing in foreign matter For more details, please refer to our catalog or feel free to contact us.
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basic information
【Specifications】 ■ Maximum roll diameter on the unwind side: 800, 850, 800, 1000mm ■ Maximum width of the base material: 650, 1300, 1100, 1300mm ■ Maximum roll diameter of the product: 400, 510, 500, 1000mm ■ Minimum width of the slitter: 5, 50, 15, 8mm ■ Product width precision: 0.05, 0.1, 0.5, 0.5mm ■ Material thickness: 20-250, 15-60, 20-500, 20-600μ, etc. *For more details, please refer to the catalog or feel free to contact us.
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Daikuyou Paper will utilize the technologies we have cultivated thus far to propose a wide variety of information, materials, and techniques to our customers. In order to continue delivering important products to our customers in a "safe," "convenient," and "beautiful" manner, we aim to assist in product planning and serve as a bridge to commercialization by determining what kind of "packaging" is most effective. We will not only focus on "paper" and "packaging," but also pursue all possibilities as a total presenter that contributes to manufacturing, including "containers," "packaging materials," processing operations, packaging equipment, and environmental issues.