It suppresses the adhesive strength of the peel-up bond left after removing the tile carpet.
The "Maiko C Series" enables walking by suppressing the adhesive strength of the peel-up bond left after the removal of tile carpets, improving the workability of new flooring materials. For a mortar substrate, apply Maiko C at a rate of 100g per square meter. Any method that allows for even application, such as a diba, mop, or roller, can be used. 【Features】 ○ Suppresses the adhesive strength of the peel-up bond ○ Allows for walking and has good workability for new flooring materials ○ Applied at a rate of 100g per square meter on a mortar substrate ○ Curing time is 1 to 2 hours with natural drying ○ If curing is insufficient, apply a substrate leveling agent to increase curing strength For more details, please contact us or download the catalog.
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basic information
【Application Method】 ○ Apply at a rate of 100g per 1m² on the mortar substrate. ○ Application method: Apply as evenly as possible using a trowel, mop, roller, etc. ○ After application, allow to dry naturally or use a blower for drying. ○ After drying, perform a touch test; if there is still adhesive strength, reapply. ○ Based on the curing condition after drying, proceed to the new flooring installation process. ○ If curing is insufficient, apply a substrate leveling agent to increase curing strength. ○ Curing time is approximately 1 to 2 hours with natural drying. *However, this may vary depending on the environmental temperature at the site. ● For more details, please contact us or download the catalog.
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Company information
ORION ENTERPRISE Co., Ltd. is a company located in Setagaya, Tokyo, that specializes in floor removal, substrate adjustment, floor construction, UV coating, development of interior substrate adjustment agents, and development of interior machinery tools. Their product lineup includes "Maiko C," which enables walking by suppressing the adhesive strength of peel-up bonds left after the removal of carpet tiles, and "Maiko G," which not only suppresses the adhesive strength of peel-up bonds left after carpet tile removal but also simultaneously adjusts poor substrates.
