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  6. Printed circuit board "aluminum substrate"

Printed circuit board "aluminum substrate"

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last updated:Oct 20, 2015

富士プリント工業
富士プリント工業
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Excellent heat dissipation and heat resistance! A substrate that can also be specified with high thermal conductivity type.

Aluminum substrates have excellent heat dissipation and heat resistance that far surpass the commonly used substrate materials FR-4 and CEM-3. Recently, there has been a significant increase in substrates equipped with high-power LEDs. At Fuji Print Industry, we can create single-sided substrates with a pattern formed by laminating an insulating layer and copper foil on an aluminum base, as well as double-sided substrates with a core of aluminum, laminated with an insulating layer and copper foil to create through-holes and form patterns. 【Features】 ○ Excellent heat dissipation ○ Excellent thermal conductivity For more details, please contact us or download the catalog.

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02_almi.jpg

Printed circuit board "aluminum substrate"

02_almi.jpg
02_almi.jpg
  • Related Link - http://www.fujiprint.com/

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【Aluminum Core Substrate Manufacturing Process】 ○ Aluminum Core Drilling ○ Aluminum Core Filling ○ Lamination ○ Pressing ○ Drilling ○ Plating ● For more details, please contact us or download the catalog.

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Printed Circuit Board "Aluminum Substrate"

Printed Circuit Board "Aluminum Substrate"

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Fuji Print Industry Co., Ltd. General Catalog

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富士プリント工業

富士プリント工業

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