Wafer cleaning equipment. Ideal for customers who require high specifications of cleanliness. Capable of cleaning substrates and samples with high precision using ultrasonic cleaning.
This device is optimal for customers who require high-spec cleanliness. It is an automated system that processes each step according to the set recipe parameters for up to five 8-inch wafers simultaneously. It is a dip coater-type cleaning device that reflects the dip coating technology owned by SDI. It features a stroke of 350mm and is an ultrasonic cleaning device compatible with 8-inch substrates. It efficiently removes contaminants and residues, making it ideal for coating pretreatment. It combines high cleaning power with stability. For more details, please contact us.
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basic information
【Features】 ○ An ideal device for customers requiring high-spec cleanliness. ○ An automation device that processes each step automatically according to the set recipe parameters for up to 5 Max 8-inch wafers. ○ A dip coater-type cleaning device that reflects the dip coating technology owned by SDI. 【Specifications】 ○ Stroke: 350mm ○ Target size: 8 inches ○ Target materials: Wafers, glass ○ Dip speed: From 0.1mm/sec to 40mm/sec ○ Coating liquid circulation: Yes ○ Coating liquid temperature control: No ○ Filter mesh: No (optional) ○ Drying section: Yes ○ Drying temperature: No (optional) ○ HEPA unit: Yes ○ Device size (approx.): W:1850×D:900×H:1880mm ● For more details, please contact us.
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Applications/Examples of results
【Usage】 ○Processes up to 5 Max 8-inch wafers simultaneously or one at a time. Introduced in the pre-processing stages of semiconductor substrates, optical components, and biochips. It has a wide range of achievements in research institutions and production sites. ●For more details, please contact us.
Line up（18）
| Model number | overview |
|---|---|
| NIC-1106 | A desktop model that achieves high-precision and stable release agent application for small substrates. |
| NIC-1103 | 6 to 8 inch board compatible, versatile medium-sized nano coater. |
| NIC-0809 | Optimal for φ200mm substrates, a nano coater that supports a wide range of research and development. |
| NIC-1109G | Box-integrated design that achieves high-precision coating in an inert gas environment. |
| NIC-1208 | High-power model compatible with 600mm square substrates, achieving uniform coating of large samples. |
| NIC-1410-S1 | High-precision dip coater for small cubic samples, compatible with thicknesses up to 1.5mm. |
| NIC-1308 | Dedicated nano coater compatible with roll materials, capable of continuous coating. |
| DT-1104 | A dedicated device for achieving uniform coating on disk media. |
| MD-1501-S1 | Dip coating device with a circulation mechanism that enhances liquid stability and has high chemical resistance. |
| SA-1109 | High-precision cleaning of substrates and samples is possible with ultrasonic cleaning. |
| SA-1202 | An efficient cleaning and drying integrated device that combines warm water washing and drying. |
| NIC-1510 | A high-performance model that balances tank replacement and cleaning, suitable for multiple purposes. |
| MD-1802 | High-efficiency model enabling multilayer film formation and continuous processing with an 8-slot configuration. |
| LD-1811 | Linear type that achieves oxidation prevention and stable film formation through nitrogen purge. |
| NIC-2003 | Supports a maximum stroke of 1.3m, an ideal model for handling large circuit boards. |
| DT-1812 | Ideal for continuous process treatment, flexible support for various prototypes with an 8-tank system. |
| DT-2002 | Specialized dip coater for cylindrical materials, compatible with diameters of φ20 to 60mm. |
| NIC-2409 | Nano coater for large cylindrical materials compatible with Φ200 to 700mm sleeves. |
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