Tanimura Clean Room Cushioning Material "Clean Foam" MK-CPF
Tanimura Clean Room Cushioning Material "Conductive Clean Foam" MK-CPF
Cleanroom-compatible antistatic sponge material
Common cushioning materials include various types of cushioning agents such as foam sponge materials and air caps. However, these products cannot be used in cleanroom operations due to residues from the foaming agents used in the manufacturing process and the leakage of air from within the bubbles when they burst. On the other hand, this product does not use any foaming agents during manufacturing, preventing dust contamination from "residues of foaming agents." Additionally, unlike typical antistatic materials (colored pink or blue), it provides long-term static electricity prevention effects. Furthermore, unlike general antistatic products, the antistatic agents do not bleed (precipitate) to the surface and cause dust generation. Being a low VOC (volatile organic compounds) product, there are no concerns about metal corrosion or fogging. Of course, there is also no "specific odor of foamed PE foam" caused by chemical foaming agents. It is used in various applications as a "clean ESD countermeasure cushioning material" that requires stable static electricity control.
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basic information
■Unlike general anti-static products (pink), this provides permanent anti-static properties. ■It is made from low VOC (volatile organic compounds) materials. ■Unlike regular foam, it leaves no residue and is clean. ■There is no odor typical of general PE foam. ■The surface resistance value is 1×10^7 [Ω], demonstrating excellent anti-static performance. ■There are no concerns about metal corrosion or fogging.
Price range
P2
Delivery Time
P3
Applications/Examples of results
- For use as protective materials and cushioning materials in clean rooms. - As thermal insulation materials, cushioning packaging, and lightweight materials that suppress dust generation. - As cushioning materials for shipping boxes of electronic components and devices. - As interleaving paper and composite paper for wafers, electronic substrates, and glass substrates. - When you want to suppress the emission of chemicals from foamed materials. ≪Processing into specified shapes is possible.≫
Detailed information
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Clean form die-cut processing Square cut... We will process from a base material size of 1000×1900mm to your specified dimensions. ● Die cutting... We will create die shapes for all kinds of forms such as cylindrical, triangular, diamond, and cut-out shapes. ● Adhesive specification... An adhesive will be applied. It can be adhered by peeling off the release paper like a sticker.
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Bonding of clean forms Apply adhesive to bond the materials together. (Photo: 30mm + 10mm cylindrical bonding)
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Tanimura Clean Room Cushioning Material "Conductive Clean Foam" MK-CPF
Tanimura Clean Room Conductive Wafer Cushion TN-CWC
Company information
We are a trading company that develops products using the latest technology. We provide high-quality products such as cleanroom supplies and static electricity prevention items. Additionally, we also offer anti-slip coatings for forklifts and dumps in the safety equipment category.
