Forming a uniform protective film with dedicated design for printed circuit boards.
This device is an automatic dip coater that picks up three printed circuit boards set in a dedicated cassette simultaneously, dips them in a specialized dip coating liquid, and after drying, stores them back in the dedicated cassette. It accommodates a stroke of 185mm and is suitable for 150mm square boards. Optimized for printed circuit boards, it can uniformly coat flux and protective films. With precise control, it supports processes that enhance the durability and reliability of electronic components.
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basic information
【Main Specifications】 1. Stroke: 185mm 2. Target Size: 150mm square 3. Target Material: Printed circuit board 4. Dip Speed: From 1mm/sec to 120mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: Yes 7. Filter Mesh: Yes 8. Drying Section: Yes 9. Drying Temperature: Room temperature 10. HEPA Unit: No (optional) 11. Device Size (approx.): W:1200×D:1100×H:1780mm
Price range
P7
Delivery Time
Applications/Examples of results
Dip coating of resist for printed circuit boards and ceramic materials, as well as rust inhibitors. Used in the protective coating process for electronic circuit boards. There is a track record of evaluating the environmental resistance of new substrates for research and development purposes.
Line up（10）
| Model number | overview |
|---|---|
| SA1210 | Forming a uniform protective film with dedicated design for printed circuit boards. |
| HC-1004 | Uniform application of hard coating material achieves excellent durability in film formation. |
| FA-0406 | Achieving precise resist coating on large-area substrates with fully automated control. |
| SA-1407-S1 | Supports 2-inch wafer compatibility and precise photolithography processes. |
| SA-1503-S1 | A semi-automatic device that balances operability and precision, with excellent versatility. |
| SA-1509UL | UL-certified device equipped with a rotary mechanism capable of uniformly processing complex shapes. |
| SA-1712 | Achieving high-precision coating while minimizing liquid usage. |
| SA-1801 | Achieving high-precision processing by cleaning the surface of glass materials with ultrasonic cleaning. |
| SA-2203 | 4-inch wafer compatible, high-precision photoresist dip coater |
| SA-2210 | Mass production equipment that streamlines multilayer film formation with high-speed processing at 1000 mm/sec. |
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