We are utilized by many customers for device development and evaluation, various material development and evaluation, device parts, and customer prototypes and research and development.
Since our founding, we have built a network of trust over the course of half a century, enabling us to handle processes such as wafer size reduction, cleaning, and plating. If you have any thoughts like, "Can you do this kind of processing...," please feel free to consult with us. For more details, please download our catalog or contact us.
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【Processing Examples】 ○ Production of Cu-plated wafers ○ Cu embedding plating for Via ○ Bump plating (SnAg, ternary plating) ○ Wafer size reduction processing (up to φ300mm) ○ Wafer dicing processing ○ Texturing processing on wafers ○ Membrane processing ○ Grooving processing on wafers ● For more details, please download the catalog or contact us.
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Company information
Omura Giken Co., Ltd. is a company engaged in machining, high-pressure/special gas piping, welding, assembly, design, and the regeneration and ancillary work of used semiconductor manufacturing equipment. Our refined technology is adopted in many industries that require precision, meticulousness, and safety, including the semiconductor industry, liquid crystal displays, fuel cells, eco-related fields, food factories, various manufacturing plants, pharmaceutical research institutes, and research organizations. Our motto is "Omura Giken when in trouble," and we strive to be more flexible, prompt, and advanced, always pursuing 100% customer satisfaction.