We can accommodate a small number of pieces, making it ideal for prototype development! We can provide consistent manufacturing according to your needs!
We provide SOI wafers manufactured using a bonding method. We can also offer custom production according to specifications and e-SOI wafers with controlled edge shapes. We accommodate small lot sizes and can support patterning (such as PZT, Deep-RIE, etc.). Please first contact us with your main specifications. For small lots, we may be able to respond quickly using our stock. For new production, we can accommodate orders starting from 15 pieces, depending on the specifications. We can also provide SOI wafers (e-SOI wafers) with controlled edge shapes. For more details, please download the catalog or contact us.
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basic information
**Features** - Wafer sizes: Φ100mm, Φ125mm, Φ150mm, Φ200mm - Active layer substrate → Crystal orientation: <100> <111> <110> → Wafer thickness: 10–300μm → Resistivity: 0.001–1,000 (Ω·cm) → Surface finish: Mirror - BOX → Thickness: 0.2–2μm - Support substrate → Crystal orientation: <100> <111> <110> → Wafer thickness: 10–300μm → Resistivity: 0.001–1,000 (Ω·cm) → Surface finish: Mirror For more details, please download the catalog or contact us.
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Company information
Omura Giken Co., Ltd. is a company engaged in machining, high-pressure/special gas piping, welding, assembly, design, and the regeneration and ancillary work of used semiconductor manufacturing equipment. Our refined technology is adopted in many industries that require precision, meticulousness, and safety, including the semiconductor industry, liquid crystal displays, fuel cells, eco-related fields, food factories, various manufacturing plants, pharmaceutical research institutes, and research organizations. Our motto is "Omura Giken when in trouble," and we strive to be more flexible, prompt, and advanced, always pursuing 100% customer satisfaction.