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  6. Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

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last updated:Jan 17, 2024

ケイツー
ケイツー
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By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.

Copper with a standard thickness of 18μ can generate high heat and, in some cases, may even break when a large current flows through it, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper thickness of 400μ. For more details, please contact us or refer to our catalog.

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

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【Features】 ○ Boards can be manufactured using standard substrate methods for thicknesses ranging from 35μ to 105μ. → When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such boards can be addressed by increasing the thickness of the copper foil, but K2 Corporation can manufacture boards using standard substrate methods for thicknesses ranging from 35μ to 105μ. ○ By using a special manufacturing method, boards with a maximum copper foil thickness of 400μ can be produced. ○ Capable of handling specifications that cannot be processed using conventional through-hole board manufacturing methods. ○ Based on past experience and achievements, we challenge various types of boards and have succeeded in development. ○ Also capable of accommodating the precision enhancement of printed circuit boards. ● For more details, please contact us or refer to our catalog.

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Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)

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Have you ever struggled with short deadlines?

Have you ever struggled with short deadlines?

TECHNICAL
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Have you ever been turned down because of a special substrate?

Have you ever been turned down because of a special substrate?

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Are you paying unnecessary initial costs?

Are you paying unnecessary initial costs?

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

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Have you ever been betrayed by quality?

Have you ever been betrayed by quality?

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Are you having trouble with component mounting?

Are you having trouble with component mounting?

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ケイツー

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In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to produce a wide variety of circuit boards in a short time frame through in-house integrated production, thereby meeting these demands. "Better products, faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.

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