Use of a dicing device equipped with a rotating blade.
To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. The mainstream method involves using a dicing machine equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. The cutting water can be compatible with pure water. We accommodate everything from prototype processing to mass production. Additionally, we can provide cutting methods tailored to your applications (such as scribing). For more details, please contact us or refer to our catalog.
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basic information
【Features】 ○ The use of dicing equipment with integrated rotating blades is mainstream. ○ Processing of materials such as Si wafers, glass, ceramics, single crystal materials, and resins is also possible. ○ Cutting water can be compatible with pure water. ○ Support from prototype processing to mass production. ○ Cutting methods tailored to applications (such as scribing) are also available. 【Capabilities】 ○ Processing technologies: full cut, half cut, U-groove, V-groove processing. ○ Materials: various types of glass, ceramics, single crystal materials, resins, etc. ○ Shapes: round flat plates, square flat plates. ○ External dimensions: max φ12 inches (for Si wafers). ○ Substrate thickness: max 3 mm (for glass). ○ Polishing of glass and back grinding of Si wafers are also possible. ○ Automatic chip tray packing is also possible. ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
【Applications】 ○ IC chips, various ceramic components, optical pickup components, various electronic components, cover glass, etc. ● For more details, please contact us or refer to the catalog.
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.