Case Studies on the Use of Thermal Design Support Tools for Electronic Devices [Measures for Miniaturization and High Performance]
By utilizing support tools for miniaturization and high performance of electronic devices, it is possible to simulate hundreds of boards equipped with components!
We are currently offering a collection of case studies utilizing the thermal design support tool "FloTHERMR" for electronic devices! 【Contents of the Case Study Collection】 ■ DENSO Utilized "FloTHERM, FloTHERM PCB," and "modeFRONTIER" to solve thermal issues for engine ECUs. ■ Lenovo Japan Thoroughly utilized FloTHERM simulations from the early stages of development. *For more details, please request the materials or view the PDF data from the download section.
Inquire About This Product
basic information
◎Various Shape Templates Specialized for Electronic Devices Numerous shape templates specific to electronic devices, such as heat sinks, fans, printed circuit boards, and package components, are included. By combining these templates using a mouse, you can easily create thermal fluid models. ◎Rich Library of Shapes and Material Properties At the time of installation, you can access over 1,000 types of libraries. Moreover, shape models for fans, heat sinks, thermal conductive sheets, etc., are registered with the part numbers published by each manufacturer, and material properties such as copper and FR4 are registered with names that are easy for designers to recognize. ◎Utilization of Semiconductor Package Models Created with FloTHERM PACK You can incorporate detailed models of semiconductor packages, two-resistor models, and DELPHI models created with FloTHERM PACK into your analysis models.
Price range
Delivery Time
Applications/Examples of results
By combining with products handled by IDAJ, such as the multi-purpose robust design optimization support tool "modeFRONTIER," we provide additional value.
catalog（4）
Download All Catalogs![Case Studies on the Use of Thermal Design Support Tools for Electronic Devices [Measures for Miniaturization and High Performance]](https://image.www.ipros.com/public/catalog/image_generated/01/56e/248566/248566_IPROS4788941257731675169_1.jpg?w=120&h=170)
![Case Studies of Utilizing Optimization Support Tools [Reduction of Development Man-Hours and Cost Savings]](https://image.www.ipros.com/public/catalog/image_generated/01/158/241972/241972_IPROS8701566309915947278_1.jpg?w=120&h=170)
![Case Studies of Software Development Support Tool Utilization [Integrated Management from Design to Development]](https://image.www.ipros.com/public/catalog/image_generated/01/c38/248690/248690_IPROS2780261686975553277_1.jpg?w=120&h=170)
![Case Studies of Automotive Simulation Tool Utilization [Reduction of Development Man-Hours and Cost Savings]](https://image.www.ipros.com/public/catalog/image_generated/01/f7c/248693/248693_IPROS6469956558397498303_1.jpg?w=120&h=170)
Company information
While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We form partnerships with leading-edge software vendors of the era, providing a comprehensive engineering environment necessary to solve our customers' increasingly diverse and complex challenges using top-level domestic digital engineering technologies, including thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions.