We can accommodate from BGA packages to 12” wafers!
□ The BGA package is compact yet features a 6-zone specification. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for purification within the furnace. □ Wafer transport uses a uniquely developed walking beam method.
Inquire About This Product
basic information
We have a product lineup that supports everything from BGA packages to 12” wafers. We are fully equipped with testing machines at all times and are ready to meet our customers' needs whenever they arise. Please feel free to consult with us!
Price range
Delivery Time
Applications/Examples of results
(Main Uses and Examples of Achievements) □ BGA package substrates □ For forming bumps in wafer-level CSP □ Mounting of QFP and other electronic components, etc.
catalog（3）
Download All Catalogs
Company information
Dai Nichi Shoji Co., Ltd. was founded in 1959 as an import trading company and has been providing products such as temperature sensors, plastic products, consumable materials, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, and established a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to respond quickly to customer needs and problem-solving, as well as our commitment to manufacturing. To survive in the rapidly changing electronics industry, we will continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.
