A adhesive that combines strong adhesion and high thermal conductivity. It achieves an unprecedented level of thermal conductivity among thermal conductive adhesives.
By applying it between the heating element and the heat dissipation element, adhesion and thermal conduction can be achieved. 【Features】 ● It is used by mixing components A and B. ● Can be stored at room temperature. ● Highly flexible, providing excellent workability. ● Heat-resistant and cold-resistant, suitable for a wide range of environments. ● Made in Japan for peace of mind.
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basic information
Product Name: J-Thermo03M Type: Two-component mixed type (A agent/B agent). Since it is a two-component mixed type, please mix thoroughly until it reaches a clay-like consistency before use. Additionally, pressing the object against the adhesive for a while will make it easier to fix. - Thermal conductivity: 3W/m·K - Capacity: A agent 1g/B agent 1g, A agent 2g/B agent 2g, A agent 50g/B agent 50g, A agent 100g/B agent 100g, A agent 150g/B agent 150g - Operating temperature range: After curing, -20℃ to 200℃. - Room temperature curing conditions: Approximately 2 days in winter, approximately 1 day in summer - Non-conductive - Glass transition temperature: -40℃ - Hardness: 80 Shore A - Mixing ratio: 1:1 *The container may change without notice.
Price information
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Delivery Time
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Applications/Examples of results
It is used for heat dissipation of CPUs, MPUs, GPUs, and other high-power electronic components. It can be mounted on heat sinks for high-brightness LEDs and other heat-generating elements.
Company information
Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
